Additive Manufacture Breakout Board
Description
A simple, parametric, 3-D printable device that allows for SOIC-type components to be used in DIP package circuits (i.e., breadboards, protoboards, etc.). The geometry was designed to: (1) enforce physical contact between component leads and header pins and (2) guide header pins to align and make contact with the breadboard or protoboard. Full details: Brooks, C.K.; Peplinski, J.E.; Pearce, J.M. Overcoming Chip Shortages: Low-Cost Open-Source Parametric 3-D Printable Solderless SOIC to DIP Breakout Adapters. Inventions 2023, 8, 61. https://doi.org/10.3390/inventions8020061 The design was developed to provide reliable and consistent electrical contact between the component and the rest of the circuit and was demonstrated with reusable 8-SOIC to DIP breakout adapters. The additive manufacture breakout board (AMBB) design was developed using two different open-source modelers, OpenSCAD and FreeCAD, to provide reliable and consistent electrical contact between the component and the rest of the circuit and was demonstrated with reusable 8-SOIC to DIP breakout adapters. OpenSCAD is an open-source script-only based modeler that my hacker-type students prefer. FreeCAD, an open-source parametric 3-D modeler tends to be preferred by mechanical engineers. Both were used for the computer-aided design (CAD) of the additive manufacture breakout board (AMBB). The models from both OpenSCAD and FreeCAD are functionally identical and were created to provide users with more flexibility and increase accessibility. The AMBB hardware is licensed under CERN-OHL-S. The three-part design was optimized for manufacturing with an open source RepRap-class fused filament 3-D printers, like from Lulzbot in the U.S., Creality in China or Prusa/Ultimaker in Europe making the AMBB a prime candidate for use in distributed manufacturing models. More info: https://www.appropedia.org/Overcoming_Chip_Shortages:_Low-cost_Open-source_Parametric_3-D_Printable_Solderless_SOIC_to_DIP_Breakout_Adapters
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